| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a dual-purpose laser dicing and concurrent die-bonding sheet which can prevent cutting of the dual-purpose dicing and die-bonding sheet by a laser beam, damage of a chuck table and fusion of the dual-purpose dicing and die-bonding sheet to the chuck table, in a direct bonding process employing a laser dicing process, and to provide a method for manufacturing a chip composite by the direct die-bonding process that uses the sheet. <P>SOLUTION: This dual-purpose laser dicing and die bonding sheet includes a base material containing at least a polyurethaneacrylate layer, and an adhesive layer for die bonding which is peelably formed on one surface of the base material. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
