发明名称
摘要 PROBLEM TO BE SOLVED: To reduce color unevenness of a solid imaging device which has a plurality of wiring layers by reducing ripples of reflected light by an interface between a passivation film formed on wiring and an inter-layer insulating film and reflected light on a light receiving surface. SOLUTION: The solid imaging device has a light reception part 102 arranged on a substrate, and also has a plurality of wiring layers (104-108) on the substrate. At least one of the wiring layers is arranged on a substantially flat first insulating film (107). Furthermore, the solid imaging device has a part which comes into contact with the first insulating film on the wiring layer (108) arranged on the first insulating film, having a second insulating film (109) differing in refractive index from the first insulating film, and having a third insulating film which includes a part having two or more kinds of refractive indexes (112, 113) in a film thickness direction, at least at a part on the light reception part. COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP5318165(B2) 申请公布日期 2013.10.16
申请号 JP20110177127 申请日期 2011.08.12
申请人 发明人
分类号 H01L27/14;H04N5/369;H04N9/07 主分类号 H01L27/14
代理机构 代理人
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