发明名称 SUBSTRATE CLEANING APPARATUS USED IN CHEMICAL MECHANICAL POLISHING SYSTEM
摘要 PURPOSE: A substrate cleaning apparatus used in a chemical mechanical polishing system is provided to easily remove foreign substances and prevent pollution by forming a liquid flow layer on the entire inner wall of a cover. CONSTITUTION: A substrate support unit (110) supports a substrate and rotates together. A rotation driving part (120) rotates and drives the substrate support unit. The cleaning solution is supplied onto the surface of the substrate through a cleaning solution supply hole. A cover (130) surrounds the circumference of the substrate support unit in a radial direction. A liquid supply part supplies liquid onto the inner surface of the cover.
申请公布号 KR101318510(B1) 申请公布日期 2013.10.16
申请号 KR20120070718 申请日期 2012.06.29
申请人 K.C.TECH CO., LTD. 发明人 KIM, SEONG KYO
分类号 H01L21/302;H01L21/304 主分类号 H01L21/302
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