摘要 |
PURPOSE: A substrate cleaning apparatus used in a chemical mechanical polishing system is provided to easily remove foreign substances and prevent pollution by forming a liquid flow layer on the entire inner wall of a cover. CONSTITUTION: A substrate support unit (110) supports a substrate and rotates together. A rotation driving part (120) rotates and drives the substrate support unit. The cleaning solution is supplied onto the surface of the substrate through a cleaning solution supply hole. A cover (130) surrounds the circumference of the substrate support unit in a radial direction. A liquid supply part supplies liquid onto the inner surface of the cover. |