EDGE RING COOLING MODULE FOR SEMI-CONDUCTOR MANUFACTURE CHUCK

摘要

PURPOSE: An edge ring cooling module for a semiconductor manufacture chuck is provided to reduce bad products by compulsively emitting the heat of an edge ring through the upper surface of a large diameter part. CONSTITUTION: A chuck body (10) comprises a large diameter part and a short diameter part. An edge ring (20) is combined with the outside of the short diameter part. A lower heat conduction ring corresponds to the edge ring. A thermoelectric element (32) is fixed to the upper surface of the lower heat conduction ring. An upper heat conduction ring is fixed to the upper surface of the thermoelectric element.