发明名称 |
CONDUCTING PATH AND SEMICONDUCTOR DEVICE |
摘要 |
A conduction path includes a first conduction path forming plate (11) made of a first metal and having a through hole (13), and a second conduction path forming plate (15) made of a second metal and having a press-fit portion (17) press-fitted into the through hole. A wall surface of the through hole and a side surface of the press-fit portion forms an inclined bonding surface (18) inclined relative to a normal line of an overlap surface of the first conduction path forming plate and the second conduction path forming plate, and a bonding portion (25) formed by metal flow is formed in a region located in a periphery of the inclined bonding surface. |
申请公布号 |
EP2650915(A1) |
申请公布日期 |
2013.10.16 |
申请号 |
EP20110846724 |
申请日期 |
2011.11.30 |
申请人 |
PANASONIC CORPORATION |
发明人 |
MINAMIO, MASANORI;TANAKA, ZYUNYA;IMURA, RYOUTAROU |
分类号 |
H01L23/48;B21D39/03;H01L23/00;H01L23/495;H01L23/50 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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