| 摘要 |
<p>PURPOSE: A chip on board type UV led package and a method for manufacturing the same are provided to perform a remote irradiation process by using a reflector between the rows and the columns of UV light sources. CONSTITUTION: Electrode patterns are formed on a substrate. UV light sources (3) are arrayed on the substrate at regular intervals. The UV light sources include an encapsulation material (32) or a lens (31). A reflection device increases the irradiation distance of light emitted from the UV light. At least one reflector (4) separates the rows or the columns of the UV light sources from each other.</p> |
