发明名称 Coated silicon wafer
摘要 A silicon wafer is coated on one major surface with a layer of a silicon oxide. The silicon wafer surface has average pyramid angle roughness equal to or greater than 10°. The silicon oxide coating layer has a thickness of 100 to 1000nm and is non-conformal, so that the surface of the coating on the wafer has average pyramid angle roughness of at least 5° lower than the average pyramid angle roughness of the silicon wafer surface.
申请公布号 GB201315727(D0) 申请公布日期 2013.10.16
申请号 GB20130015727 申请日期 2013.09.04
申请人 DOW CORNING CORPORATION 发明人
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