发明名称 |
PRINTED CIRCUIT BOARD ASSEMBLY AND A METHOD FOR MANUFACTURING THE PRINTED CIRCUIT BOARD ASSEMBLY |
摘要 |
<p>Printed circuit board assembly including an optical subassembly having a carrying face for carrying at least one optoelectronic component in a such way that light emitted from/directed to is transmitted through the optical subassembly; a printed circuit board having a supporting area for supporting the optical subassembly; wherein the printed circuit board supporting area includes a hole lodging at least one part of the optoelectronic component and wherein at least one part of the carrying face is fixed by flip-chip bonding to at least one part of the supporting area.</p> |
申请公布号 |
EP2649865(A1) |
申请公布日期 |
2013.10.16 |
申请号 |
EP20110815786 |
申请日期 |
2011.12.07 |
申请人 |
FCI |
发明人 |
YABRE, GNITABOURE;STRICOT, YVES |
分类号 |
H05K1/02;H05K1/18 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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