| 摘要 |
<p>The method involves filling microporous structures and/or channels between a silicon wafer (8) and a glass plate (9) with a filling compound i.e. octadecanol, and sawing of the filled composite. The composite is placed on a holder (2) before sawing with a wafer side at an edge-side. The composite is heated for melting of the filling compound by a heating device (1) i.e. heating plate, resting against the holder. A cooling process is performed by cooling gas i.e. nitrogen, led on the glass plate. The cooling gas is applied in a center of the composite.</p> |
