| 摘要 |
In order to provide a reflow soldering apparatus wherein poor soldering, in which bubbles remain within soldering sections upon soldering, is reduced, a reflow soldering apparatus of the present invention, which solders electronic parts onto a circuit board (9) using heated ambient gas, while conveying the circuit board (9) with the electronic parts mounted thereon through preheating chambers (2A, 2B, 2C) and reflow chambers (3A, 3B) arranged sequentially within a furnace (1), is equipped with a decompression chamber (6), which can reduce ambient pressure, inside the reflow chamber (3B) wherein the heated ambient gas circulates, and soldering sections of the circuit board (9) that have been heated and melted are defoamed in the decompression chamber (6). |
