| 摘要 |
The invention relates to a breaking method for bonding substrates, wherein the process is simplified and the strength of the end face of the breaking surface is ensured. A slot-less first cutter wheel is provided. A second cutter wheel provided with a slot is also adopted, wherein the circumferential length of the slot is greater than the circumferential length of a protrusion. The scribing is performed by the first cutter wheel along the first direction of a first substrate and is performed also by the second cutter wheel along the first direction of a second substrate. Then a short strip-shaped bonding substrate is formed through the breaking treatment. After that, the scribing is performed by the first cutter wheel along the second direction of the second substrate of the short strip-shaped bonding substrate, and is performed also by the second cutter wheel along the second direction of the first substrate. Finally, the bonding substrate is divided into unit substrates through the breaking treatment. |
