| 摘要 |
<P>PROBLEM TO BE SOLVED: To miniaturize a power module which reduces the mounting area. <P>SOLUTION: In an insulating substrate 2, the power module includes: a positive-electrode conductor pattern 40 to which one terminal of a positive-electrode side power semiconductor element is connected; an intermediate potential conductor pattern 50 to which the other terminal of the positive-electrode side power semiconductor element and one terminal of a negative-electrode side power semiconductor element are connected; and a negative electrode conductor pattern 30 to which the other terminal of the negative-electrode side power semiconductor element is connected. The power module is further equipped with: one or more couples of unit modules which each apply a source voltage between the positive electrode conductor pattern and the negative electrode conductor pattern so as to lead conversion output out of the intermediate potential conductor pattern; and an relay board 10 in which a wiring pattern for relaying and distributing a gate signal common to the corresponding power semiconductor elements of respective unit module is formed by printing. The relay substrates are arranged at intermediate positions between corresponding power semiconductor elements of the respective unit modules, such that the relay substrates are overlapped each other on an insulating substrate. <P>COPYRIGHT: (C)2010,JPO&INPIT |
