发明名称 LED MODULE AND METHOD FOR MANUFACTURING THE SAME
摘要 PURPOSE: An LED module and a manufacturing method thereof increase heat radiation performance by forming an inclined part at the central axis of a thermal base with a tube expansion process. CONSTITUTION: A thermal base is made of thermally conductive materials. A bonding member (120) is combined with the thermal base. A printed circuit (130) is laminated on the thermal base. An LED package (140) is mounted on the thermal base. The LED package has a heat radiation pad and an electrode pad at the lower surface.
申请公布号 KR101319588(B1) 申请公布日期 2013.10.16
申请号 KR20120027253 申请日期 2012.03.16
申请人 发明人
分类号 F21S2/00;F21V29/00 主分类号 F21S2/00
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