发明名称 |
Semiconductor package cooled by grounded cooler |
摘要 |
A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together. |
申请公布号 |
US8558375(B2) |
申请公布日期 |
2013.10.15 |
申请号 |
US201113170475 |
申请日期 |
2011.06.28 |
申请人 |
MAMITSU KUNIAKI;KANEKO TAKAHISA;TONOMOTO MASAYA;NISHIHATA MASAYOSHI;WADO HIROYUKI;NORITAKE CHIKAGE;NOMURA EIJI;ITOH TOSHIKI;DENSO CORPORATION |
发明人 |
MAMITSU KUNIAKI;KANEKO TAKAHISA;TONOMOTO MASAYA;NISHIHATA MASAYOSHI;WADO HIROYUKI;NORITAKE CHIKAGE;NOMURA EIJI;ITOH TOSHIKI |
分类号 |
H01L23/34 |
主分类号 |
H01L23/34 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|