SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR CHIP HAVING THE SAME AND STACKED SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A semiconductor substrate, a semiconductor chip including the same, and a stacked semiconductor package are provided to prevent a threshold voltage shift by improving the gettering properties of metal. CONSTITUTION: A substrate body (110) includes one surface, the other surface, and a trench. The trench is formed on a device region. An active layer (120) is formed in the trench. A gettering layer (130) is formed between the active layer and the inner surface of the substrate body.