发明名称 |
Multi-step and asymmetrically shaped laser beam scribing |
摘要 |
Methods of dicing substrates by both laser scribing and plasma etching. A method includes laser ablating material layers, the ablating leading with a first irradiance and following with a second irradiance, lower than the first. Multiple passes of a beam adjusted to have different fluence level or multiple laser beams having various fluence levels may be utilized to ablate mask and IC layers to expose a substrate with the first fluence level and then clean off redeposited materials from the trench bottom with the second fluence level. A laser scribe apparatus employing a beam splitter may provide first and second beams of different fluence from a single laser.
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申请公布号 |
US8557683(B2) |
申请公布日期 |
2013.10.15 |
申请号 |
US201113180336 |
申请日期 |
2011.07.11 |
申请人 |
LEI WEI-SHENG;EATON BRAD;YALAMANCHILI MADHAVA RAO;SINGH SARAVJEET;KUMAR AJAY;HOLDEN JAMES M.;APPLIED MATERIALS, INC. |
发明人 |
LEI WEI-SHENG;EATON BRAD;YALAMANCHILI MADHAVA RAO;SINGH SARAVJEET;KUMAR AJAY;HOLDEN JAMES M. |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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