发明名称 |
Method of manufacturing light emitting diode package |
摘要 |
A method of manufacturing a light emitting diode package. A cup-shaped package structure with a recess formed therein and an electrode structure formed on a bottom of the recess is prepared. A light emitting diode chip is mounted on a bottom of the recess with a terminal of the chip electrically connected to the electrode structure. A liquid-state transparent resin is injected in the recess and before the liquid-state transparent resin is completely cured, a stamp with a micro rough pattern engraved thereon is applied on an upper surface of the resin. The liquid-state transparent resin is cured with the stamp applied thereon to form a resin encapsulant and the stamp is removed from the resin encapsulant.
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申请公布号 |
US8557617(B2) |
申请公布日期 |
2013.10.15 |
申请号 |
US20070709130 |
申请日期 |
2007.02.22 |
申请人 |
PARK YOUN GON;LEE JONG MYEON;LEE HAI SUNG;CHANG MYUNG WHUN;CHOO HO SUNG;SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
PARK YOUN GON;LEE JONG MYEON;LEE HAI SUNG;CHANG MYUNG WHUN;CHOO HO SUNG |
分类号 |
H01L21/00;H01L33/22;H01L33/50;H01L33/54;H01L33/56;H01L33/62 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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