| 摘要 |
<p>PURPOSE: A board carrier device for double-sided electroplating a solar cell is provided to simply insert and load a wafer substrate on a supporting device and to simply mount the wafer substrate on the carrier device. CONSTITUTION: A board carrier device (100) for double-sided electroplating a solar cell includes a wafer receiving region (105), clip mounting rods (106, 107, 108, 109), and a plurality of first and second clips. The clip mounting rods are installed on the left and right sides of the wafer receiving region, rotate at fixed positions, and open and close the clips. The first clips are installed on the clip mounting rods by being separated at constant intervals. The second clips are installed around the wafer receiving region and penetrated through holes formed on the second projected supporting units.</p> |
