发明名称 Alignment for backside illumination sensor
摘要 Provided is an apparatus that includes an integrated circuit located in a first region of a substrate having first and second opposing major surfaces and an alignment mark located in a second region of the substrate and extending through the substrate between the first and second surfaces.
申请公布号 US8558351(B2) 申请公布日期 2013.10.15
申请号 US201213550140 申请日期 2012.07.16
申请人 LIU JEN-CHENG;YAUNG DUN-NIAN;WUU SHOU-GWO;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 LIU JEN-CHENG;YAUNG DUN-NIAN;WUU SHOU-GWO
分类号 H01L23/544 主分类号 H01L23/544
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