发明名称 |
Alignment for backside illumination sensor |
摘要 |
Provided is an apparatus that includes an integrated circuit located in a first region of a substrate having first and second opposing major surfaces and an alignment mark located in a second region of the substrate and extending through the substrate between the first and second surfaces.
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申请公布号 |
US8558351(B2) |
申请公布日期 |
2013.10.15 |
申请号 |
US201213550140 |
申请日期 |
2012.07.16 |
申请人 |
LIU JEN-CHENG;YAUNG DUN-NIAN;WUU SHOU-GWO;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
LIU JEN-CHENG;YAUNG DUN-NIAN;WUU SHOU-GWO |
分类号 |
H01L23/544 |
主分类号 |
H01L23/544 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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