| 发明名称 |
THERMOSETTING EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE |
| 摘要 |
<p>A thermosetting epoxy resin composition characterized by containing as a resin ingredient a product of pulverization of a solid matter obtained by reacting a triazine derivative/epoxy resin with an acid anhydride in such a proportion that the amount of the epoxy groups is 0.6-2.0 equivalents to the acid anhydride groups.</p> |
| 申请公布号 |
KR101318279(B1) |
申请公布日期 |
2013.10.15 |
| 申请号 |
KR20087005178 |
申请日期 |
2006.07.28 |
| 申请人 |
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发明人 |
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| 分类号 |
C08G59/20;C08L63/00;H01L23/29;H01L23/31 |
主分类号 |
C08G59/20 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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