发明名称 Method and installation for exposing the surface of an integrated circuit
摘要 The invention relates to a method for exposing an integrated circuit by ablating the polymer coating initially covering the integrated circuit, characterized in that it includes the combined application of a laser radiation and a plasma onto the coating initially covering the integrated circuit.
申请公布号 US8555728(B2) 申请公布日期 2013.10.15
申请号 US20070521444 申请日期 2007.12.12
申请人 DESPLATS ROMAIN;OBEIN MICHAEL;CENTRE NATIONAL D'ETUDES SPATIALES 发明人 DESPLATS ROMAIN;OBEIN MICHAEL
分类号 G01N3/24 主分类号 G01N3/24
代理机构 代理人
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