发明名称 |
Method and installation for exposing the surface of an integrated circuit |
摘要 |
The invention relates to a method for exposing an integrated circuit by ablating the polymer coating initially covering the integrated circuit, characterized in that it includes the combined application of a laser radiation and a plasma onto the coating initially covering the integrated circuit. |
申请公布号 |
US8555728(B2) |
申请公布日期 |
2013.10.15 |
申请号 |
US20070521444 |
申请日期 |
2007.12.12 |
申请人 |
DESPLATS ROMAIN;OBEIN MICHAEL;CENTRE NATIONAL D'ETUDES SPATIALES |
发明人 |
DESPLATS ROMAIN;OBEIN MICHAEL |
分类号 |
G01N3/24 |
主分类号 |
G01N3/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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