发明名称 |
Vialess integration for dual thin films-thin film resistor and heater |
摘要 |
A process is described for integrating two closely spaced thin films without deposition of the films through deep vias. The films may be integrated on a wafer and patterned to form a microscale heat-trimmable resistor. A thin-film heating element may be formed proximal to a thin-film resistive element, and heat generated by the thin-film heater can be used to permanently trim a resistance value of the thin-film resistive element. Deposition of the thin films over steep or abrupt topography is minimized by using a process in which the thin films are deposited in a sequence that falls between depositions of thick metal contacts to the thin films.
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申请公布号 |
US8558654(B2) |
申请公布日期 |
2013.10.15 |
申请号 |
US201113340255 |
申请日期 |
2011.12.29 |
申请人 |
LE NEEL OLIVIER;PRIVITERA STEFANIA MARIA SERENA;DUMONT-GIRARD PASCALE;CASTORINA MAURIZOGABRIELE;LEUNG CALVIN;STMICROELECTRONICS (GRENOBLE 2) SAS;STMICROELECTRONICS S.R.L.;STMICROELECTRONICS PTE LTD. |
发明人 |
LE NEEL OLIVIER;PRIVITERA STEFANIA MARIA SERENA;DUMONT-GIRARD PASCALE;CASTORINA MAURIZOGABRIELE;LEUNG CALVIN |
分类号 |
H01C7/10 |
主分类号 |
H01C7/10 |
代理机构 |
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