发明名称 HEATING STRUCTURE OF OCHER FLOOR
摘要 PURPOSE: A heating device for a red clay floor is provided to make rapid and even heat conductivity by forming a pipe panel and an uneven plate of a metal material. CONSTITUTION: A heating device for a red clay floor comprises a floor support body, a pipe panel (10), a heating pipe (11), red clay (12), an uneven plate (13), a floor finishing material (14), and a mold (19). A cement mortar layer and an adiabatic sandwich panel (2) are placed on a concrete slab (1), and then multiple plywoods (3) are horizontally installed thereon to form the floor support body. The pipe panel is curved to form multiple upper and lower head portions (17,18) and grooves (15,16). In order to connect the grooves in one direction, the pipe panel is assembled on the top of the floor support body in a check figure. The heating pipe is installed in the upper part of the grooves of the pipe panel. The grooves of the pipe panel are filled with the red clay. The uneven plate is crossly assembled on the top of the pipe panel in the check figure. The floor finishing material is constructed on the top of the uneven plate. The mold is installed in the edge of the floor and has an outlet.
申请公布号 KR101318200(B1) 申请公布日期 2013.10.15
申请号 KR20120035420 申请日期 2012.04.05
申请人 LEE, SANG HYUK 发明人 LEE, SANG HYUK
分类号 F24D3/12;E04F15/00;F24D19/00 主分类号 F24D3/12
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