发明名称 Circuit module
摘要 An electronic component includes a component body including a mounting surface facing a circuit substrate, and a plurality of first external electrodes arranged on the mounting surface so as to extend between a first side and a second side of the mounting surface substantially parallel with each other and so as to be within a first region having a width that is substantially equal to half a length of the first side in a direction in which the first side extends. A circuit substrate includes a substrate body, a plurality of second external electrodes, arranged on a main surface of the substrate body, respectively connected to the plurality of the first external electrodes, and support units arranged to protrude from the main surface of the substrate body and such that the electronic component overlaps the support units outside the first region.
申请公布号 US8558119(B2) 申请公布日期 2013.10.15
申请号 US20100876438 申请日期 2010.09.07
申请人 TAKAHASHI YASUHIRO;MURATA MANUFACTURING CO., LTD. 发明人 TAKAHASHI YASUHIRO
分类号 H05K1/16 主分类号 H05K1/16
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