| 摘要 |
This electronic component (10) is provided with an inorganic substrate (20), a conductor film (30) formed on a surface of the substrate, and bonding wires (50, 55) bonded to a part of said conductor film, and wire bonding sections (40, 45) are formed on at least a part of the electronic component. The part of the conductor film at least forming the aforementioned wire bonding sections contains an Ag-based metal formed of Ag or an alloy having Ag as the main constituent and a metal oxide which coats said Ag-based metal and which has, as a constituent element, any of the elements selected from the group consisting of Al, Zr, Ti, Y, Ca, Mg, and Zn. The coating quantity of the metal oxide is a quantity corresponding to 0.02 to 0.1 parts by mass relative to 100 parts by mass of the aforementioned Ag-based metal. |
