| 发明名称 |
FLEXIBLE CIRCUIT COVERFILM ADHESION ENHANCEMENT |
| 摘要 |
<p>Provided is a means of improving the adhesion between a flexible circuit coverfilm and an encapsulant material in an inkjet printer application.</p> |
| 申请公布号 |
KR20130113330(A) |
申请公布日期 |
2013.10.15 |
| 申请号 |
KR20127032708 |
申请日期 |
2011.05.06 |
| 申请人 |
3M INNOVATIVE PROPERTIES COMPANY |
发明人 |
PALANISWAMY RAVI;TAN FONG LIANG;IMKEN RONALD L.;GORRELL ROBIN E. |
| 分类号 |
H05K3/34;H05K3/38 |
主分类号 |
H05K3/34 |
| 代理机构 |
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代理人 |
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| 主权项 |
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