发明名称 Interconnect structure containing various capping materials for electrical fuse and other related applications
摘要 A design structure is provided for interconnect structures containing various capping materials for electrical fuses and other related applications. The structure includes a first interconnect structure having a first interfacial structure and a second interconnect structure adjacent to the first structure. The second interconnect structure has second interfacial structure different from the first interfacial structure.
申请公布号 US8558384(B2) 申请公布日期 2013.10.15
申请号 US201213537879 申请日期 2012.06.29
申请人 HSU LOUIS L.;TONTI WILLIAM R.;YANG CHIH-CHAO;INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 HSU LOUIS L.;TONTI WILLIAM R.;YANG CHIH-CHAO
分类号 H01L23/48;H01L23/52;H01L29/40 主分类号 H01L23/48
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