发明名称 |
Interconnect structure containing various capping materials for electrical fuse and other related applications |
摘要 |
A design structure is provided for interconnect structures containing various capping materials for electrical fuses and other related applications. The structure includes a first interconnect structure having a first interfacial structure and a second interconnect structure adjacent to the first structure. The second interconnect structure has second interfacial structure different from the first interfacial structure.
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申请公布号 |
US8558384(B2) |
申请公布日期 |
2013.10.15 |
申请号 |
US201213537879 |
申请日期 |
2012.06.29 |
申请人 |
HSU LOUIS L.;TONTI WILLIAM R.;YANG CHIH-CHAO;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
HSU LOUIS L.;TONTI WILLIAM R.;YANG CHIH-CHAO |
分类号 |
H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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