发明名称 Package embedded equalizer
摘要 A passive equalizer circuit is embedded within a substrate of a package containing an integrated circuit. It is believed that substantial reduction in uneven frequency dependent loss may be achieved for interconnects interconnecting the integrated circuit with other integrated circuits on a printed circuit board. Other aspects are described and claimed.
申请公布号 US8558636(B2) 申请公布日期 2013.10.15
申请号 US20070694765 申请日期 2007.03.30
申请人 SHIN JAEMIN;MEIER PASCAL A.;KAMGAING TELESPHOR;AYGUN KEMAL;INTEL CORPORATION 发明人 SHIN JAEMIN;MEIER PASCAL A.;KAMGAING TELESPHOR;AYGUN KEMAL
分类号 H04B3/04;H03G11/04;H05K1/18 主分类号 H04B3/04
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