发明名称 |
Package embedded equalizer |
摘要 |
A passive equalizer circuit is embedded within a substrate of a package containing an integrated circuit. It is believed that substantial reduction in uneven frequency dependent loss may be achieved for interconnects interconnecting the integrated circuit with other integrated circuits on a printed circuit board. Other aspects are described and claimed.
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申请公布号 |
US8558636(B2) |
申请公布日期 |
2013.10.15 |
申请号 |
US20070694765 |
申请日期 |
2007.03.30 |
申请人 |
SHIN JAEMIN;MEIER PASCAL A.;KAMGAING TELESPHOR;AYGUN KEMAL;INTEL CORPORATION |
发明人 |
SHIN JAEMIN;MEIER PASCAL A.;KAMGAING TELESPHOR;AYGUN KEMAL |
分类号 |
H04B3/04;H03G11/04;H05K1/18 |
主分类号 |
H04B3/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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