发明名称 |
Sensor module and method for manufacturing a sensor module |
摘要 |
A method of manufacturing a sensor module includes providing a substrate comprising an array of magnetically sensitive elements on a first main face of the substrate. An array of conducting lines is applied over the first main face of the substrate. An array of electrical interconnects is applied over the first main face of the substrate. The substrate is singulated after application of the electrical interconnects.
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申请公布号 |
US8559139(B2) |
申请公布日期 |
2013.10.15 |
申请号 |
US20070956971 |
申请日期 |
2007.12.14 |
申请人 |
THEUSS HORST;INTEL MOBILE COMMUNICATIONS GMBH |
发明人 |
THEUSS HORST |
分类号 |
G11B5/39 |
主分类号 |
G11B5/39 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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