发明名称 Multilayer rigid flexible printed circuit board and method for manufacturing the same
摘要 The present invention provides a multilayer rigid flexible printed circuit board including: a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same.
申请公布号 US8558116(B2) 申请公布日期 2013.10.15
申请号 US20100923994 申请日期 2010.10.19
申请人 LEE YANG JE;YANG DEK GIN;AN DONG GI;SHIN JAE HO;SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE YANG JE;YANG DEK GIN;AN DONG GI;SHIN JAE HO
分类号 H05K1/00 主分类号 H05K1/00
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