发明名称 |
Multilayer rigid flexible printed circuit board and method for manufacturing the same |
摘要 |
The present invention provides a multilayer rigid flexible printed circuit board including: a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same.
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申请公布号 |
US8558116(B2) |
申请公布日期 |
2013.10.15 |
申请号 |
US20100923994 |
申请日期 |
2010.10.19 |
申请人 |
LEE YANG JE;YANG DEK GIN;AN DONG GI;SHIN JAE HO;SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE YANG JE;YANG DEK GIN;AN DONG GI;SHIN JAE HO |
分类号 |
H05K1/00 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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