| 摘要 |
PURPOSE: A light emitting device package is provided to load much more chips by making round the exposed plane of a reflection plate for mounting the chips. CONSTITUTION: A circuit substrate defines a first cavity. The first cavity exposes a part of a reflection plate (110). At least one light emitting diode chip (170) is arranged on the reflection plate. The light emitting diode chip is connected to the circuit substrate through a wire (150A, 150B). The first cavity is formed into a round plane. |
