SOLDER REFLOW MACHIN FOR MANUFACTURING SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A solder reflow machine for manufacturing a semiconductor package is provided to improve efficiency by dividing a reflow zone into several regions. CONSTITUTION: A multiple conveyer belts are arranged within the oven of equipment. The multiple conveyer belts comprise a first, a second, and a third conveyer belt. The first conveyor belt is arranged in the preheat zone (14) of a heating part. A second conveyer belt is arranged in a reflow zone (16). The third conveyer belt is arranged in a cooling part (18).