METHOD FOR MANUFACTURING BACKSIDE ILLUMINATED IMAGE SENSOR

摘要

PURPOSE: A method for manufacturing a backside illumination image sensor is provided to form a barrier layer by using a metal oxide layer, thereby preventing filling failure. CONSTITUTION: A device isolation layer (107) is formed on the front surface of a semiconductor substrate. A light receiving device is formed in the active region of the semiconductor substrate. An interlayer dielectric (117) is formed on the front surface of the semiconductor substrate. A super contact hole (119) is formed in the pad region. A barrier layer is formed on the bottom surface and the sidewall of the super contact hole.