METHOD FOR FABRICATING A PACKAGE BOARD

摘要

PURPOSE: A package substrate manufacturing method is provided to improve the degree of freedom in design by electrically gold-plating a copper foil with a lead line. CONSTITUTION: Copper foils (20a, 20b) are formed at the core. The core is copper-plated. The copper foil on the top surface and the copper foil of the bottom surface are electrically connected. A mask is formed on the copper foil of the bottom surface. A gold plating layer (70) is formed on a bonding pad (60) through electrical gold coating.