发明名称 CONDUCTIVE PATTERN FOR SUBMINIATURE SMD FUSE
摘要 PURPOSE: A conductor pattern structure for a surface mounting micro type fuse appropriate for mass production is provided to enhance the electrical characteristics by using low temperature dried conductive paste. CONSTITUTION: Low temperature dried conductive paste is coated in an I-shape. The land area of the low temperature dried conductive paste occupies 80% or greater of the total area. Surface-mount devices use the low temperature dried conductive paste. The width of the fuse element of the low temperature dried conductive paste is 400-2000um. The length of the fuse element of the low temperature dried conductive paste is 50-500um.
申请公布号 KR20130111831(A) 申请公布日期 2013.10.11
申请号 KR20120034027 申请日期 2012.04.02
申请人 SM HI-TECH CO., LTD. 发明人 PARK, WON HYUNG;KIM, JEE HOON;KIM, HYO CHEON;KANG, BYEONG WOO
分类号 H01H85/046;H05K1/16 主分类号 H01H85/046
代理机构 代理人
主权项
地址