发明名称 |
CONDUCTIVE PATTERN FOR SUBMINIATURE SMD FUSE |
摘要 |
PURPOSE: A conductor pattern structure for a surface mounting micro type fuse appropriate for mass production is provided to enhance the electrical characteristics by using low temperature dried conductive paste. CONSTITUTION: Low temperature dried conductive paste is coated in an I-shape. The land area of the low temperature dried conductive paste occupies 80% or greater of the total area. Surface-mount devices use the low temperature dried conductive paste. The width of the fuse element of the low temperature dried conductive paste is 400-2000um. The length of the fuse element of the low temperature dried conductive paste is 50-500um. |
申请公布号 |
KR20130111831(A) |
申请公布日期 |
2013.10.11 |
申请号 |
KR20120034027 |
申请日期 |
2012.04.02 |
申请人 |
SM HI-TECH CO., LTD. |
发明人 |
PARK, WON HYUNG;KIM, JEE HOON;KIM, HYO CHEON;KANG, BYEONG WOO |
分类号 |
H01H85/046;H05K1/16 |
主分类号 |
H01H85/046 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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