| 摘要 |
PURPOSE: A carrier head for a chemical mechanical polishing system is provided to easily control polishing uniformity by individually applying polishing pressure to each predetermined areas in a chemical mechanical polishing process. CONSTITUTION: A carrier head (900) for a chemical mechanical polishing system comprises a base (100), a base board accepting unit (600), two or more bladders (200, 300), and one or more barrier structures (700). The bladders are connected to the bottom of the base inside the base board accepting unit and are expanded using a fluid to individually apply polishing pressure to each predetermined areas on the inner surface of the base board accepting unit by coming in contact with the inner surface of the base board accepting unit. The barrier structures are connected to the bottom of the base to limit the horizontal expansion of the bladders. |
