PURPOSE: A silicon device having an EMI shield is provided to improve a shielding effect by using a grounding part electrically connected to the silicon device. CONSTITUTION: A lower semiconductor chip is mounted on a lower substrate. The lower semiconductor package (110L) includes a ground wire. An upper semiconductor package (110U) is laminated on the lower semiconductor package. A package bump electrically connects the upper semiconductor package and the lower semiconductor package. A conductive cover (200) is electrically connected to the ground wire.
