| 摘要 |
PURPOSE: A sputtering device is provided to apply high power by improving the efficiency of cooling a target, thereby improving productivity and a deposition quality according to an increase of a thin film deposition rate. CONSTITUTION: A sputtering device includes a chamber (100), a substrate transferring-supporting unit (200), a rotary cathode (300), a power supplying unit (410), and an electrical connection unit. The chamber forms a deposition space for a substrate. The substrate transferring-supporting unit supports the substrate to be transferred. The rotary cathode provides deposition materials to the substrate. The power supplying unit supplies power to the rotary cathode. The electrical connection unit is arranged between the rotary cathode and the power supplying unit and electrically connects the rotary cathode and the power supplying unit. |
