BONDING WIRE FOR SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A bonding wire for a semiconductor device and a manufacturing method thereof are provided to increase adhesion between metal particles and a core material by coating a core material with an oxidation resistance metal. CONSTITUTION: A core material is coated with an oxidation resistance metal (310). A wire is formed by the coating process. A drawing process is performed on the wire at least one time (330). A thermal process is performed on the wire (350). The wire is made of copper or copper alloy. [Reference numerals] (310) Oxidation resistance metal coating process; (330) Drawing process; (350) Thermal process