| 摘要 |
PURPOSE: A sputtering device is provided to facilitate cooling water to flow to an end block, thereby reducing time required for replacing a target. CONSTITUTION: A sputtering device includes a chamber (100), a substrate transferring-supporting unit (200), a rotary cathode (300), a power supplying unit (410), and an electrical connection unit. The chamber forms a deposition space for a substrate. The rotary cathode provides deposition materials to the substrate. The power supplying unit supplies power to the rotary cathode. The electrical connection unit electrically connects the rotary cathode and the power supplying unit. The rotary cathode includes a target, a cathode backing tube, a target cooling unit, an end block, and a cooling water guiding unit. |
