发明名称 ABRASIVE GRAINS, SLURRY, AND POLISHING SOLUTION
摘要 PROBLEM TO BE SOLVED: To provide abrasive grains which enable polishing a polished film with an excellent polishing speed irrespective of presence or absence of additive agent used together with the abrasive grains.SOLUTION: A first liquid and a second liquid are mixed in a condition that a parameter Z indicated by the following expression (1) is 5.00 or more, so as to provide abrasive grains containing hydroxide of a tetravalent metal element. Z=[1/(&Dgr;pH×k)]×(N/M)/1000 (1) [where, &Dgr;pH indicates a variation amount of pH per minute in a reaction system, k indicates a reaction temperature coefficient represented by the following expression (2), N indicates a circulation number (min-1), and M indicates a substitution number (min-1) represented by the following expression (5)], k=2[(T-20)/10] (2) [where, T indicates a temperature (°C) of the reaction system], M=v/Q (5) [where, v indicates a mixing speed (m3/min) of the first liquid and the second liquid, Q indicates a liquid volume (m3) obtained by mixing the first liquid and the second liquid]
申请公布号 JP2013211570(A) 申请公布日期 2013.10.10
申请号 JP20130098587 申请日期 2013.05.08
申请人 HITACHI CHEMICAL CO LTD 发明人 IWANO TOMOHIRO;MINAMI HISATAKA;AKIMOTO HIROTAKA
分类号 H01L21/304;B24B37/00;C09K3/14 主分类号 H01L21/304
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