INTEGRATED DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an integrated device having excellent insulation resistance.SOLUTION: A groove having a side face consisting of an inclined surface is provided between adjoining devices. When the side provided with an electronic circuit or an MEMS device is the front face, the groove is made narrower from the front face toward the back face by the inclined surface. Since a mold material (insulation material) exists in the groove, a plurality of devices are bonded mechanically while being insulated electrically from each other. A wiring material for electrically conducting the adjoining devices is formed along the side face and bottom face of the groove. When taking out the wiring to the back face, a hole is formed in the bottom face of the groove so that the wiring material is exposed from the hole to the back face.