发明名称 TOOL FOR TEMPORARILY FIXING ELECTRONIC SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a tool for temporarily fixing an electronic substrate, capable of highly accurately positioning the electronic substrate and having excellent work efficiency.SOLUTION: A tool 10 for temporarily fixing an electronic substrate 2 is used for temporarily fixing the electronic substrate 2 to an opening 6a of a core sheet 6. The tool for temporarily fixing the electronic substrate includes: a base body 11 on which the core sheet 6 and the electronic substrate 2 are placed; and a base portion 30 supporting the base body 11 from the lower side. The base portion 30 includes: a first support body 15 for positioning the core sheet 6; and a second support body 17 for positioning the electronic substrate 2 in the opening 6a. Through holes to which the first and second support bodies 15, 17 can be inserted are formed on the base body 11, and the first and second support bodies 15, 17 are disposed to project from a surface of the base body 11 via the through holes. The base portion 30 is movable in a direction separating from the base body 11.
申请公布号 JP2013208778(A) 申请公布日期 2013.10.10
申请号 JP20120080009 申请日期 2012.03.30
申请人 DAINIPPON PRINTING CO LTD 发明人 ISHIKAWA MAO
分类号 B42D15/10;G06K19/077 主分类号 B42D15/10
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