发明名称 IMPROVED MULTI-PLY PANEL
摘要 <p>The present invention relates to a multi-ply panel for forming or adding to a wall, floor, or ceiling, or for the inclined surface of a building. Said panel is formed of a stack of layers, at least one of which is formed of: parallel structural strips, preferably made of wood; and filler strips that are placed between the structural strips and made of a different material than that of the structural strips. Said materials may be selected for the heat or sound insulation properties, thermal inertia, or fire-resistant properties thereof. At least one rigid filler strip is made of an insulating material with heat conductivity less than 0.038 W/m.K.</p>
申请公布号 WO2013150188(A1) 申请公布日期 2013.10.10
申请号 WO2012FR50781 申请日期 2012.04.11
申请人 TECHNIWOOD;BOURDON, LAURENT;FAURE, PASCAL;GOY, DIDIER;CHABRIER, CHRISTIAN 发明人 BOURDON, LAURENT;FAURE, PASCAL;GOY, DIDIER;CHABRIER, CHRISTIAN
分类号 E04B1/90;B32B3/14;B32B3/18;B32B5/14;B32B7/00;B32B21/04;E04B1/94;E04B2/42;E04C2/12;E04C2/42 主分类号 E04B1/90
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