发明名称 |
ULTRASONIC TRANSDUCER ELEMENT CHIP, PROBE, ELECTRONIC DEVICE AND ULTRASONIC DIAGNOSTIC APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To provide a thin ultrasonic transducer element chip having strength enduring a pressing force in the thickness direction of a substrate.SOLUTION: In this ultrasonic transducer element chip, a substrate 21 is disposed with openings 45 in an array state. In a first face of the substrate 21, each opening 45 is provided with an ultrasonic transducer element 23. A reinforcing member 52 is fixed on a second face on the opposite side of the first face of the substrate 21. The reinforcing member 52 reinforces the substrate 21. Groove parts 53 form ventilation passages communicating the inner spaces of the opening parts 45 and the outer space of the substrate 21. |
申请公布号 |
JP2013208148(A) |
申请公布日期 |
2013.10.10 |
申请号 |
JP20120078672 |
申请日期 |
2012.03.30 |
申请人 |
SEIKO EPSON CORP |
发明人 |
NAKAMURA TOMOSUKE;TSURUNO JIRO;KIYOSE SETSUNAI |
分类号 |
A61B8/00;H04R17/00 |
主分类号 |
A61B8/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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