SUBSTRATE AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a substrate capable of being suitably implanted with a resin at the time of bonding even when a fine electrode is formed.SOLUTION: A substrate 1 of a present embodiment comprises: a base material 10 having a predetermined thickness; an electrode part which is provided on one surface of the base material in a thickness direction and which includes a plurality of electrodes; and a groove 13 provided on the base material at at least a part of the surface where the electrode part is provided.