发明名称 |
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To manufacture a semiconductor device which reduces parasitic resistance and inhibits decrease in on-state current.SOLUTION: A semiconductor device manufacturing method comprises: forming an oxide semiconductor layer; forming a gate insulation layer on the oxide semiconductor layer; forming a gate electrode layer which overlaps the oxide semiconductor layer via the gate insulation layer; forming a first insulation layer so as to cover the gate insulation layer and the gate electrode layer; introducing an impurity element from above the first insulation layer to form a pair of impurity regions in the oxide semiconductor layer; forming a second insulation layer on the first insulation layer; performing anisotropic etching on the first insulation layer and the second insulation layer to form a side wall insulation layer which contacts lateral faces of the gate electrode layer; and forming a source electrode layer and a drain electrode layer, which contact the pair of impurity regions, respectively. |
申请公布号 |
JP2013211538(A) |
申请公布日期 |
2013.10.10 |
申请号 |
JP20130035484 |
申请日期 |
2013.02.26 |
申请人 |
SEMICONDUCTOR ENERGY LAB CO LTD |
发明人 |
ISOBE ATSUO;TEZUKA YOSHIAKI;ONO HIROSHI |
分类号 |
H01L21/336;H01L21/28;H01L21/8242;H01L21/8247;H01L27/105;H01L27/108;H01L27/115;H01L29/417;H01L29/786;H01L29/788;H01L29/792 |
主分类号 |
H01L21/336 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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