| 摘要 |
<p>The power module (20) has power semiconductor (1), circuit carrier (2), capillary and/or porous element (5) and heat sinks (7,10). The capillary and/or porous element is filled with a heat transfer medium (11). The power semiconductor, circuit carrier and capillary and/or porous element are encapsulated in a mold compound (4). The capillary and/or porous element is provided with three common boundary surfaces (21-23) for mold compound, circuit carrier and heat sinks respectively. Independent claims are included for the following: (1) method for preparing power module; and (2) method for operating cooling circuit on circuit carrier.</p> |
