发明名称 |
HEATING ASSEMBLY AND WAFER PROCESSING APPARATUS USING THEREOF |
摘要 |
PURPOSE: A heating member assembly and a substrate processing device including the same effectively deliver radiant energy generated from a heating member to a substrate to be heated by thinly coating the upper surface of a protective member protecting the heating member with an yttrium oxide. CONSTITUTION: A heating member (410) heats at least one substrate on a substrate support by discharging radiant energy. The heating member is composed of at least one among an optical heating member and an electric heating member. A protection member (420) transmits the radiant energy discharged from the heating member. A coating film (430) protects the protection member from process gas on a part of the protection member. The protection member includes a blocking member (422) blocking the transmission of the radiant energy discharged from the heating member and a cover member (421) covering the space of the blocking member. |
申请公布号 |
KR20130110564(A) |
申请公布日期 |
2013.10.10 |
申请号 |
KR20120032614 |
申请日期 |
2012.03.29 |
申请人 |
WONIK IPS CO., LTD. |
发明人 |
HWANG, HUI;YU, SEUNG KWAN;PARK, YOUNG HEON |
分类号 |
H01L21/02;H01L21/205 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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