| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit connection material allowing peel of a desired peeling film, and provide a manufacturing method using the circuit connection material.SOLUTION: A circuit connection material includes a first adhesive layer 11, and a second adhesive layer 12 containing a surface adjustment agent. A peel force of a first peeling film 21 adhered to the first adhesive layer 11 is smaller than that of a second peeling film 22 adhered to the second adhesive layer 12 in a normal temperature (25°C). Therefore, the first peeling film 21 can be peeled in the normal temperature, while the second peeling film 22 can be peeled in heating. |
